Browsing by Author "Probst, Gernot"
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Publication Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers
Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.386-393Publication Wafer-to-Wafer Bonding with Saddle-shaped Wafers
Proceedings paper2025, IEEE 75th Electronic Components and Technology Conference (ECTC), 2025-03-27, p.2001