Publication:

Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers

Date

2024
Proceedings Paper
https://doi.org/10.1109/ECTC51529.2024.00069
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Author(s)

Kang, Shuo  
;
Iacovo, Serena  
;
D'have, Koen  
;
Van Huylenbroeck, Stefaan  
;
Okudur, Oguzhan Orkut  
;
Alexeev, Anton
;
Plach, Thomas
;
Probst, Gernot
;
Ding, Taotao
;
Wimplinger, Markus
;
Uhrmann, Thomas
;
De Vos, Joeri  
;
Beyer, Gerald  
;
Beyne, Eric  

Journal

N/A

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