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Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers
Publication:
Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers
Date
2024
Proceedings Paper
https://doi.org/10.1109/ECTC51529.2024.00069
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Kang, Shuo
;
Iacovo, Serena
;
D'have, Koen
;
Van Huylenbroeck, Stefaan
;
Okudur, Oguzhan Orkut
;
Alexeev, Anton
;
Plach, Thomas
;
Probst, Gernot
;
Ding, Taotao
;
Wimplinger, Markus
;
Uhrmann, Thomas
;
De Vos, Joeri
;
Beyer, Gerald
;
Beyne, Eric
Journal
N/A
Abstract
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300
since deposited on 2024-12-07
Acq. date: 2025-10-25
Citations
Metrics
Views
300
since deposited on 2024-12-07
Acq. date: 2025-10-25
Citations