Publication:
Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers
| dc.contributor.author | Kang, Shuo | |
| dc.contributor.author | Iacovo, Serena | |
| dc.contributor.author | D'have, Koen | |
| dc.contributor.author | Van Huylenbroeck, Stefaan | |
| dc.contributor.author | Okudur, Oguzhan Orkut | |
| dc.contributor.author | Alexeev, Anton | |
| dc.contributor.author | Plach, Thomas | |
| dc.contributor.author | Probst, Gernot | |
| dc.contributor.author | Ding, Taotao | |
| dc.contributor.author | Wimplinger, Markus | |
| dc.contributor.author | Uhrmann, Thomas | |
| dc.contributor.author | De Vos, Joeri | |
| dc.contributor.author | Beyer, Gerald | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Kang, Shuo | |
| dc.contributor.imecauthor | Iacovo, Serena | |
| dc.contributor.imecauthor | D'have, Koen | |
| dc.contributor.imecauthor | Van Huylenbroeck, Stefaan | |
| dc.contributor.imecauthor | Okudur, Oguzhan Orkut | |
| dc.contributor.imecauthor | De Vos, Joeri | |
| dc.contributor.imecauthor | Beyer, Gerald | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Iacovo, Serena::0000-0002-0826-9165 | |
| dc.contributor.orcidimec | D'have, Koen::0000-0002-5195-9241 | |
| dc.contributor.orcidimec | Van Huylenbroeck, Stefaan::0000-0001-9978-3575 | |
| dc.contributor.orcidimec | Okudur, Oguzhan Orkut::0000-0002-4790-7772 | |
| dc.contributor.orcidimec | De Vos, Joeri::0000-0002-9332-9336 | |
| dc.contributor.orcidimec | Beyer, Gerald::0009-0001-0376-866X | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.contributor.orcidimec | D'havé, Koen::0000-0002-5195-9241 | |
| dc.date.accessioned | 2025-04-10T14:55:34Z | |
| dc.date.available | 2024-12-07T16:57:01Z | |
| dc.date.available | 2025-04-10T14:55:34Z | |
| dc.date.issued | 2024 | |
| dc.identifier.doi | 10.1109/ECTC51529.2024.00069 | |
| dc.identifier.eisbn | 979-8-3503-7598-5 | |
| dc.identifier.isbn | 979-8-3503-7599-2 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/44933 | |
| dc.publisher | IEEE COMPUTER SOC | |
| dc.source.beginpage | 386 | |
| dc.source.conference | IEEE 74th Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | MAY 28-31, 2024 | |
| dc.source.conferencelocation | Denver | |
| dc.source.endpage | 393 | |
| dc.source.journal | N/A | |
| dc.source.numberofpages | 8 | |
| dc.title | Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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