Browsing by Author "Rodet, Simon"
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Publication Copper plating for 3D interconnects
Journal article2011, Microelectronic Engineering, (88) 5, p.701-704Publication Electrodeposition for 3D integration
Proceedings paper2010, Symposium " Galvanik " Eine etablierte Technik innovativ angewendet, 25/11/2010, p.31-36Publication Front side metallization of silicon solar cells by Copper-platingaP
Proceedings paper2010-04, 2nd Workshop on Metallization for Crystalline Silicon Solar Cells, 14/04/2010Publication Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers
Proceedings paper2011-06, IEEE 61st Electronic Components and Technology Conference - ECTC, 31/05/2011, p.1384-1388Publication The way towards front side metallization by copper-plating: what we can learn from microelectronics
Oral presentation2010, 2nd Workshop on Metallization of Crystalline Silicon Solar CellsPublication TSV Cu plating and implications for CMP
Proceedings paper2011, Electronics and 3-D Packaging 4, 10/10/2011, p.11-21Publication TSV Cu plating and implications for CMP
Meeting abstract2010, 218th Electrochemical Society Meeting, 10/10/2010, p.1991Publication Void-free filling of HAR TSVs using a wet alkaline Cu seed on CVD Co as a replacement for PVD Cu seed
Journal article2011, Journal of the Electrochemical Society, (158) 2, p.H160-H165