Browsing by Author "Rodet, Simon"
Now showing 1 - 8 of 8
- Results Per Page
- Sort Options
Publication Copper plating for 3D interconnects
Journal article2011, Microelectronic Engineering, (88) 5, p.701-704Publication Electrodeposition for 3D integration
Proceedings paper2010, Symposium " Galvanik " Eine etablierte Technik innovativ angewendet, 25/11/2010, p.31-36Publication Front side metallization of silicon solar cells by Copper-platingaP
Proceedings paper2010-04, 2nd Workshop on Metallization for Crystalline Silicon Solar Cells, 14/04/2010Publication Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers
Proceedings paper2011-06, IEEE 61st Electronic Components and Technology Conference - ECTC, 31/05/2011, p.1384-1388Publication The way towards front side metallization by copper-plating: what we can learn from microelectronics
Oral presentation2010, 2nd Workshop on Metallization of Crystalline Silicon Solar CellsPublication TSV Cu plating and implications for CMP
Meeting abstract2010, 218th Electrochemical Society Meeting, 10/10/2010, p.1991Publication TSV Cu plating and implications for CMP
Proceedings paper2011, Electronics and 3-D Packaging 4, 10/10/2011, p.11-21Publication Void-free filling of HAR TSVs using a wet alkaline Cu seed on CVD Co as a replacement for PVD Cu seed
Journal article2011, Journal of the Electrochemical Society, (158) 2, p.H160-H165