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Browsing by Author "Rusu, Cristina"

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    A wet release process for fabricating slender and compliant suspended micro-mechanical structures

    Pamidighantam, Sayanu
    ;
    Laureyn, Wim
    ;
    Rusu, Cristina
    ;
    Baert, Kris
    ;
    Puers, Bob  
    ;
    Tilmans, Harrie  
    Journal article
    2003, Sensors and Actuators A: Physical, (103) 1_2, p.202-212
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    Direct integration of micromachined pipettes in a flow channel for single DNA molecule study by optical tweezers

    Rusu, Cristina
    ;
    Van't Oever, R.
    ;
    De Boer, M. J.
    ;
    Jansen, Henri
    ;
    Berenschot, J. W.
    ;
    Bennink, M. L.
    Journal article
    2001, Journal of Microelectromechanical Systems, (10) 2, p.238-246
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    Effect of deposition parameters on the stress gradient of CVD and PECVD poly-SiGe for MEMS applications

    Van der Donck, Tom
    ;
    Proost, Joris
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    Rusu, Cristina
    ;
    Baert, Kris
    ;
    Van Hoof, Chris  
    ;
    Celis, Jean-Pierre
    Proceedings paper
    2004-01, Micromachining and Microfabrication Process Technology IX, 25/01/2004, p.8-18
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    MEMS 0-level packaging using thin film poly-SiGe caps

    Rusu, Cristina
    ;
    Verbist, Agnes
    ;
    Parmentier, Brigitte  
    ;
    Witvrouw, Ann
    Proceedings paper
    2002-09, IMAPS ATW on Packaging of MEMS and Related Micro Integrated Nano Systems, 6/09/2002
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    New low-stress PECVD Poly-SiGe layers for MEMS

    Rusu, Cristina
    ;
    Sedky, S.
    ;
    Parmentier, Brigitte  
    ;
    Verbist, Agnes
    ;
    Richard, Olivier  
    ;
    Brijs, Bert
    Journal article
    2003, Journal of Microelectromechanical Systems, (12) 6, p.816-825
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    Planarization of deep trenches

    Rusu, Cristina
    ;
    Klaasse, Gerard
    ;
    Sedky, Sherif
    ;
    Esch, Heleen
    ;
    Parmentier, Brigitte  
    Proceedings paper
    2001, Micromachining and Microfabrication Process Technology VII, 22/10/2001, p.49-57
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    Self-aligned 0-level sealing of MEMS devices by a two-layer thin film reflow process

    Rusu, Cristina
    ;
    Jansen, Henri
    ;
    Gunn, Robert
    Proceedings paper
    2003, Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP of MEMS & MOEMS, 5/05/2003, p.245-250
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    Stable thin film encapsulation of acceleration sensors using polycrystalline silicon as sacrificial and encapsulation layer

    Hoechst, A.
    ;
    Scheuerer, R.
    ;
    Stahl, H.
    ;
    Fischer, F.
    ;
    Metzger, L.
    ;
    Reichenbach, R.
    ;
    Laermer, F.
    Journal article
    2004, Sensors and Actuators A, (114) 2_3, p.355-361
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    Thin film encapsulation of acceleration sensors using polysilicon sacrificial layers

    Stahl, H.
    ;
    Hoechst, A.
    ;
    Fischer, F.
    ;
    Metzger, L.
    ;
    Reichenbach, R.
    ;
    Laermer, F.
    ;
    Kronmueller, S.
    Proceedings paper
    2003, Proceedings of Transducers. The 12th International Conference on Solid-State Sensors, Actuators and Microsystems, 8/06/2003, p.1899-1902
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    Zero-level packaging for MEMS

    Rusu, Cristina
    ;
    Jourdain, Anne  
    ;
    Witvrouw, Ann
    ;
    Tilmans, Harrie  
    Proceedings paper
    2002-05, The GOOD-DIE International Workshop CAST - Challenges for Advanced Semiconductor-die Technologies, 22/05/2002

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