Browsing by Author "Rusu, Cristina"
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Publication A wet release process for fabricating slender and compliant suspended micro-mechanical structures
Journal article2003, Sensors and Actuators A: Physical, (103) 1_2, p.202-212Publication Direct integration of micromachined pipettes in a flow channel for single DNA molecule study by optical tweezers
;Rusu, Cristina ;Van't Oever, R. ;De Boer, M. J. ;Jansen, Henri ;Berenschot, J. W.Bennink, M. L.Journal article2001, Journal of Microelectromechanical Systems, (10) 2, p.238-246Publication Effect of deposition parameters on the stress gradient of CVD and PECVD poly-SiGe for MEMS applications
;Van der Donck, Tom ;Proost, Joris ;Rusu, Cristina ;Baert, Kris; Celis, Jean-PierreProceedings paper2004-01, Micromachining and Microfabrication Process Technology IX, 25/01/2004, p.8-18Publication MEMS 0-level packaging using thin film poly-SiGe caps
Proceedings paper2002-09, IMAPS ATW on Packaging of MEMS and Related Micro Integrated Nano Systems, 6/09/2002Publication New low-stress PECVD Poly-SiGe layers for MEMS
Journal article2003, Journal of Microelectromechanical Systems, (12) 6, p.816-825Publication Planarization of deep trenches
Proceedings paper2001, Micromachining and Microfabrication Process Technology VII, 22/10/2001, p.49-57Publication Self-aligned 0-level sealing of MEMS devices by a two-layer thin film reflow process
;Rusu, Cristina ;Jansen, HenriGunn, RobertProceedings paper2003, Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP of MEMS & MOEMS, 5/05/2003, p.245-250Publication Stable thin film encapsulation of acceleration sensors using polycrystalline silicon as sacrificial and encapsulation layer
;Hoechst, A. ;Scheuerer, R. ;Stahl, H. ;Fischer, F. ;Metzger, L. ;Reichenbach, R.Laermer, F.Journal article2004, Sensors and Actuators A, (114) 2_3, p.355-361Publication Thin film encapsulation of acceleration sensors using polysilicon sacrificial layers
;Stahl, H. ;Hoechst, A. ;Fischer, F. ;Metzger, L. ;Reichenbach, R. ;Laermer, F.Kronmueller, S.Proceedings paper2003, Proceedings of Transducers. The 12th International Conference on Solid-State Sensors, Actuators and Microsystems, 8/06/2003, p.1899-1902Publication Zero-level packaging for MEMS
Proceedings paper2002-05, The GOOD-DIE International Workshop CAST - Challenges for Advanced Semiconductor-die Technologies, 22/05/2002