Browsing by Author "Schols, G."
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Publication A five layer thin film MCM-Si design using oxynitride dielectrics
Proceedings paper1997, Proceedings of the 11th European Microelectronics Conference; 14-16 May 1997. Venice, Italy., p.637-640Publication A five layer thin film MCM-Si design using oxynitride dielectrics
Oral presentation1997, IMAPS/NATO Advanced Research Workshop on Electronic Packaging for High Reliability, Low Cost Electronics; May 1997; Bled, SlovenPublication A five-layer thin film MCM-Si design using oxynitride dielectrics
Journal article1998, Microelectronics International (Hybrid Circuits), (15) 1, p.39-42Publication A new cost-effective TAB technology for small and medium volumes
Proceedings paper1995, Proceedings of the 10th European Microelectronics Conference; May 1995; Copenhagen, Denmark., p.547-558Publication A silicon backplane technology for microdisplays
Proceedings paper1999, ESSDERC'99 - Proceedings of the 29th European Solid-State Device Research Conference; 13-15 September 1999; Leuven, Belgium., p.712-715Publication Design of an x-Si Aactive matrix for high resolution reflective displays
Proceedings paper1995, Proceedings of the 15th International Display Research Conference. Asia Display 1995; October 1995; Hamamatsu, Japan., p.477-479Publication Design, fabrication and bumping of test chips for development of fine pitch flip-chip technologies
Proceedings paper1999, Proceedings of the 12th European Microelectronics and Packaging Conference, 7/06/1999, p.399-404Publication HIPERPRINT= a board technology for high-frequency applications
Proceedings paper2000, IMAPS-EUROPE PRAGUE 2000. European Microelectronics Packaging and Interconnection Symposium Proceedings, 18/06/2000, p.326-332Publication Standard SMT process for flip-chip assembly on FR4 substrate
Publication The design and fabrication of a 2560x2048 pixel microdisplay chip
Proceedings paper1999, Proceedings of the 19th International Display Research Conference - EuroDisplay, 28/09/1999, p.493-496Publication Two-layer silicon hybrids interconnect
Proceedings paper1995, Proceedings of the 10th European Microelectronics Conference; May 1995; Copenhagen, Denmark., p.162-171Publication Two-layer silicon hybrids interconnect technology
Proceedings paper1995, Proceedings 1995 International Conference on Multichip Modules; April 1995; Denver, Colorado, USA., p.375-380