Browsing by Author "Sood, Sumant"
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Publication 300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications
Meeting abstract2010-11, IEEE International 3D System Integration Conference - 3DIC, 16/11/2010Publication A study of microbump metrology and defectivity at 20m pitch and below for 3D TSV stacking
Proceedings paper2015, 13th International Wafer Level Packaging Conference - IWLPC, 13/10/2015Publication Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding
Proceedings paper2010, IEEE International Interconnect Technology Conference - IITC, 6/06/2010