Browsing by Author "Truzzi, Claudio"
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Publication A compact star- and extended-target sensor
Publication A MCM-D type module for the ATLAS pixel detector
Proceedings paper1998, IEEE Nuclear Science Symposium 1998, 8/11/1998, p.38-41Publication A MCM-D-type module for the ATLAS pixel detector
Journal article1999, IEEE Trans. Nuclear Science, (46) 6, part2, p.1861-1864Publication A step towards MCM design automation
Proceedings paper1998, Proceedings of the IEEE Symposium on IC/Package Design Integration, 2/02/1998, p.74-80Publication A system level approach to a structured MCM design methodology
Proceedings paper1998, Proceedings 1998 International Conference on Multichip Modules and High Density Packaging, 15/04/1998, p.184-189Publication A system level approach to a structured MCMdesign methodology
Proceedings paper1998, Proceedings of the IEEE Workshop on Chip/Package Co-Design, 24/03/1998, p.12-19Publication An infrastructure for the dissemination of information on KGD
Publication An infrastructure for the selection of bare die (KGD) and the design of multichip modules
Publication Compact CMOS vision systems for space use
Publication Design of test modules for the analysis of MCM interconnects
Proceedings paper1996, Proceedings European Design and Test Conference - ED&TC '96, 11/03/1996, p.614Publication Electrical modeling and characterisation of high speed digital circuits on thin-film MCM
Proceedings paper1997, Proceedings of the 11th European Microelectronics Conference - EMC '97; May 1997. Venice, Italy., p.524-531Publication Electrical performance of high speed digital systems on thin film MCM
Proceedings paper1997, Proceedings of the 3rd ESA Electronic Component Conference - EECC, 22/04/1997, p.171-176Publication Flip-chip redistribution using stencilprinted bumps
Oral presentation1999, Area Array Packaging Technologies WorkshopPublication High speed / high frequency digital MCMs - A case study
Oral presentation1996, VLSI Packaging Workshop of JapanPublication Implications of the use of FPGAs in bare die form for high density packaging applications
Publication Lead-free solder BGAs and polymer stud grid arrays
Oral presentation2000, Electronics Goes Green 2000+; 11-13 September 2000; Berlin, Germany.Publication MCM-D for high speed digital applications - Electrical modelling and performance evaluation
Proceedings paper1997, Proceedings of the 6th International Conference on Multichip Modules - MCM, 2/04/1997, p.29-34Publication MCM-D switching units for interconnection technology validation
Proceedings paper1996, Proceedings of the IEEE Multi-Chip Module Conference - MCMC'96, 6/02/1996, p.132-137Publication Miniaturised electronic products towards an easy access to high density packaging solutions
Publication On the use of bare-die field programmable devices in miniaturized systems