Browsing by Author "Tsau, Yan Wen"
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Publication Simulation of Bulge-Out Mechanism Enabling Sub-0.5 μm Scaling of Hybrid Wafer-to-Wafer Bonding
Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.1853-1858Publication Simulation of Cu bulge-out by cyclic Cu surface diffusion FEM in Cu/SiCN hybrid bonding
; ; ; Proceedings paper2023, 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), APR 16-19, 2023Publication Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding
Journal article2022, MICROELECTRONICS RELIABILITY, 138, p.114716