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Simulation of Cu bulge-out by cyclic Cu surface diffusion FEM in Cu/SiCN hybrid bonding
Publication:
Simulation of Cu bulge-out by cyclic Cu surface diffusion FEM in Cu/SiCN hybrid bonding
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Date
2023
Proceedings Paper
https://doi.org/10.1109/EuroSimE56861.2023.10100784
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Tsau, Yan Wen
;
De Messemaeker, Joke
;
Gonzalez, Mario
;
Seefeldt, Marc
;
Beyne, Eric
;
De Wolf, Ingrid
Journal
N/A
Abstract
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803
since deposited on 2023-10-15
1
last month
Acq. date: 2025-12-13
Citations
Metrics
Views
803
since deposited on 2023-10-15
1
last month
Acq. date: 2025-12-13
Citations