Publication:

Simulation of Cu bulge-out by cyclic Cu surface diffusion FEM in Cu/SiCN hybrid bonding

Date

2023
Proceedings Paper
https://doi.org/10.1109/EuroSimE56861.2023.10100784
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dc.contributor.authorTsau, Yan Wen
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorGonzalez, Mario
dc.contributor.authorSeefeldt, Marc
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorTsau, Yan Wen
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Messemaeker, Joke::0000-0002-4872-0176
dc.contributor.orcidimecGonzalez, Mario::0000-0003-4374-4854
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2024-05-06T14:35:09Z
dc.date.available2023-10-15T17:21:19Z
dc.date.available2024-05-06T14:35:09Z
dc.date.issued2023
dc.description.wosFundingTextThis work was supported by the 3D System Integration program of imec and its partners.
dc.identifier.doi10.1109/EuroSimE56861.2023.10100784
dc.identifier.eisbn979-8-3503-4597-1
dc.identifier.issn2833-8553
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42757
dc.publisherIEEE
dc.source.conference24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
dc.source.conferencedateAPR 16-19, 2023
dc.source.conferencelocationGraz
dc.source.journalN/A
dc.source.numberofpages5
dc.title

Simulation of Cu bulge-out by cyclic Cu surface diffusion FEM in Cu/SiCN hybrid bonding

dc.typeProceedings paper
dspace.entity.typePublication
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