Publication:

Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding

Date

2022

Journal article

https://doi.org/10.1016/j.microrel.2022.114716

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Author(s)

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De Messemaeker, Joke

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Salahouelhadj, Abdellah

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Gonzalez, Mario

;

Witters, Liesbeth

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;

;

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De Wolf, Ingrid

Journal

MICROELECTRONICS RELIABILITY

Metrics

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Acq. date: 2025-12-13