Publication:
Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding
| dc.contributor.author | Tsau, Yan Wen | |
| dc.contributor.author | De Messemaeker, Joke | |
| dc.contributor.author | Salahouelhadj, Abdellah | |
| dc.contributor.author | Gonzalez, Mario | |
| dc.contributor.author | Witters, Liesbeth | |
| dc.contributor.author | Zhang, Boyao | |
| dc.contributor.author | Seefeldt, Marc | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | De Wolf, Ingrid | |
| dc.contributor.imecauthor | Tsau, Yan Wen | |
| dc.contributor.imecauthor | De Messemaeker, Joke | |
| dc.contributor.imecauthor | Salahouelhadj, Abdellah | |
| dc.contributor.imecauthor | Gonzalez, Mario | |
| dc.contributor.imecauthor | Witters, Liesbeth | |
| dc.contributor.imecauthor | Zhang, Boyao | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | De Wolf, Ingrid | |
| dc.contributor.orcidimec | De Messemaeker, Joke::0000-0002-4872-0176 | |
| dc.contributor.orcidimec | Salahouelhadj, Abdellah::0000-0002-3795-1446 | |
| dc.contributor.orcidimec | Gonzalez, Mario::0000-0003-4374-4854 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
| dc.contributor.orcidimec | Witters, Liesbeth::0000-0002-0772-5501 | |
| dc.contributor.orcidimec | Zhang, Boyao::0000-0002-7976-0146 | |
| dc.date.accessioned | 2023-03-09T12:47:55Z | |
| dc.date.available | 2023-01-09T03:12:33Z | |
| dc.date.available | 2023-03-09T12:47:55Z | |
| dc.date.issued | 2022 | |
| dc.description.wosFundingText | This work was supported by the 3D System Integration program of imec and its partners. | |
| dc.identifier.doi | 10.1016/j.microrel.2022.114716 | |
| dc.identifier.issn | 0026-2714 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40952 | |
| dc.publisher | PERGAMON-ELSEVIER SCIENCE LTD | |
| dc.source.beginpage | 114716 | |
| dc.source.endpage | na | |
| dc.source.issue | na | |
| dc.source.journal | MICROELECTRONICS RELIABILITY | |
| dc.source.numberofpages | 5 | |
| dc.source.volume | 138 | |
| dc.subject.keywords | STRESS | |
| dc.title | Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
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