Browsing by Author "Vakanas, George"
- Results per page
- Sort Options
Publication Bismuth-based solder characterization for lower-temperature assembly of thermally-sensitive components in 3D interconnect applications
Meeting abstract2014, 23rd Conference on Materials for Advanced Metallization - MAM, 2/03/2013Publication Co-Sn intermetallic compoundsfor potential integration in 3D interconnects
Meeting abstract2014, 23rd Conference on Materials for Advanced Metallization - MAM, 2/03/2014Publication Cobalt UBM for fine pitch microbump applications in 3DIC
Proceedings paper2015, IEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM, 18/05/2015, p.221-224Publication Formation of compounds and Kirkendall vacancy in the Cu-Sn system
Publication Formation, processing and characterization of Co-Sn intermetallic compounds for potential integration in 3D interconnects
Journal article2015, Microelectronic Engineering, 140, p.72-80Publication Mechanical characterization of micro-bump for aggressive bump scaling
Proceedings paper2012, 4th Electronics System Integration Technologies Conference - ESTC, 17/09/2012Publication Metallurgies evaluation (Sn vs. SnCu0.7% vs. SnAg) for 3D bumping and stacking
Meeting abstract2014, TMS Annual Meeting & Exhibition, 16/02/2014Publication Processing and characterization of Co-Sn intermetallic compounds
Publication Reflow process optimization for micro-bumps applications in 3D technology
Proceedings paper2014, 5th Electronics System-Integration Technology Conference - ESTC, 16/09/2014, p.1-5Publication Sn whisker evaluations in 3D microbumped structures
Journal article2014, Microelectronics Reliability, (54) 9_10, p.1982-1987Publication Thiol based self-assenbled monolayers (SAMs) as an alternative surface finish for 3D Cu microbumps
Proceedings paper2015, TMS Conference, 15/03/2015Publication Whisker evaluations in 3D microbump structures
Meeting abstract2014, 143 rd TMS Annual Meeting and Exhibition, 16/02/2014