Browsing by Author "Varga, Istvan"
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Publication A quantitative adhesion study between contacting materials in Cu damascene structures
Journal article2002, Applied Surface Science, (201) 1_4, p.20-34Publication A quantitative study of the adhesion between copper, barrier and organic low-k polymers
Proceedings paper2001, Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics, 23/04/2000, p.D1.4.1-D1.4.6Publication A quantitative study of the adhesion between copper, barrier and organic low-k polymers
Oral presentation2000, MRS Spring Meeting 2000. Symposium D: Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics