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A quantitative adhesion study between contacting materials in Cu damascene structures
Publication:
A quantitative adhesion study between contacting materials in Cu damascene structures
Date
2002
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Lanckmans, Filip
;
Brongersma, Sywert
;
Varga, Istvan
;
Poortmans, Jef
;
Bender, Hugo
;
Conard, Thierry
;
Maex, Karen
Journal
Applied Surface Science
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2045
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations
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Views
2045
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations