Publication:

A quantitative adhesion study between contacting materials in Cu damascene structures

Date

 
dc.contributor.authorLanckmans, Filip
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorVarga, Istvan
dc.contributor.authorPoortmans, Jef
dc.contributor.authorBender, Hugo
dc.contributor.authorConard, Thierry
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorPoortmans, Jef
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.contributor.orcidimecPoortmans, Jef::0000-0003-2077-2545
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.date.accessioned2021-10-14T22:08:14Z
dc.date.available2021-10-14T22:08:14Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6515
dc.source.beginpage20
dc.source.endpage34
dc.source.issue1_4
dc.source.journalApplied Surface Science
dc.source.volume201
dc.title

A quantitative adhesion study between contacting materials in Cu damascene structures

dc.typeJournal article
dspace.entity.typePublication
Files
Publication available in collections: