Browsing by Author "Vats, Hemant"
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Publication 21 nm Pitch dual-damascene BEOL process integration with full barrierless Ru metallization
Proceedings paper2019, IEEE International Interconnect Technology Conference (IITC 2019) and Materials for Advanced Metallization Conference (MAM 2019), 3/06/2019, p.3.4Publication Supervia Process Integration and Reliability Compared to Stacked Vias Using Barrierless Ruthenium
Proceedings paper2020, IEEE International Electron Devices Meeting (IEDM), DEC 12-18, 2020Publication Three-layer BEOL process integration with supervia and self-aligned-block options for the 3nm node
Proceedings paper2019, IEEE International Electron Devices Meeting - IEDM, 7/12/2019, p.454-457