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21 nm Pitch dual-damascene BEOL process integration with full barrierless Ru metallization
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21 nm Pitch dual-damascene BEOL process integration with full barrierless Ru metallization
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Date
2019
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vega Gonzalez, Victor
;
Wilson, Chris
;
Paolillo, Sara
;
Decoster, Stefan
;
Mao, Ming
;
Versluijs, Janko
;
Blanco, Victor
;
Kesters, Els
;
Le, Quoc Toan
;
Lorant, Christophe
;
Varela Pedreira, Olalla
;
Lesniewska, Alicja
;
Heylen, Nancy
;
El-Mekki, Zaid
;
van der Veen, Marleen
;
Webers, Tomas
;
Vats, Hemant
;
Rynders, Luc
;
Cupak, Miroslav
;
Lee, Jae Uk
;
Drissi, Youssef
;
Halipre, Luc
;
Charley, Anne-Laure
;
Verdonck, Patrick
;
Witters, Thomas
;
Van Gompel, Sander
;
Kimura, Yosuke
;
Jourdan, Nicolas
;
Ciofi, Ivan
;
Contino, Antonino
;
Boccardi, Guillaume
;
Lariviere, Stephane
;
De Wachter, Bart
;
Vancoille, Eric
;
Lazzarino, Frederic
;
Ercken, Monique
;
Kim, Ryan Ryoung han
;
Trivkovic, Darko
;
Croes, Kristof
;
Leray, Philippe
;
Pardons, Katrien
;
Barla, Kathy
;
Tokei, Zsolt
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Views
2832
since deposited on 2021-10-27
7
last month
5
last week
Acq. date: 2025-12-11
Citations