Browsing by Author "Vendier, O."
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Publication Dynamic compact thermal models for an ultra thin chip stacking technology
Proceedings paper2002, Proceedings of the 3rd Eurosime Conference, 14/04/2002, p.93-100Publication Example of MNT implementation to realise V band active primary feed for satellite antenna application
Publication Exploring the limits of Arrhenius-based life testing with heterojunction bipolar transistor technology
Journal article2002, Microelectronics Reliability, (42) 9_11, p.1359-1363Publication Multi-layer thin-film MCM-D for the realization of Q- and V-band functions
Proceedings paper2003, IEEE International Microwave Symposium Digest - MTT-S, 8/06/2003, p.1151-1154Publication Residual thermo-mechanical stresses in thinned-chip assemblies
Proceedings paper1999, Proceedings of 5th International Workshop on Thermal Investigations of ICs and Microstructures - THERMINIC, 3/10/1999, p.306-311Publication Residual thermomechanical stresses in thinned-chip assemblies
Journal article2000, IEEE Trans. Components and Packaging Technologies, (23) 4, p.673-679Publication Thermal management in a new ultra-thin chip stack technology
; Proceedings paper2001, Proceedings of the 2nd Eurosime Conference; 9-11 April 2001; Paris, France., p.269-276Publication Thermal modeling and management in ultrathin chip stack technology
; ; Publication Ultra thin electronics for space applications
; ; Publication UTCS: ultra thin chip stacking a WSI emulation technology
Proceedings paper2000, 3rd Round Table on Micro/Nano-Technologies for Space, 15/05/2000, p.81-84