Browsing by Author "Verlinden, B."
Now showing 1 - 6 of 6
- Results per page
- Sort Options
Publication Brittle to ductile fracture transition in bulk Pb-free solders
Journal article2007, IEEE Trans. Components and Packaging Technologies, (30) 3, p.416-423Publication Dry oxidation mechanisms of copper in trenches
Journal article2002, Microelectronic Engineering, (64) 1_4, p.63-71Publication Effect of recrystallization and grain growth on the reliability of Cu-Cu wire bonds
Proceedings paper2003, IMAPS-Nordic, 21/09/2003, p.126-132Publication On the atomistic details of electromigration-induced drift
Journal article2004, Scripta Materialia, (50) 2, p.267-271Publication Orientation imaging microscopy applications in Cu-interconnects and Cu-Cu wire bonding
Proceedings paper2002, Proceedings 28th International Symposium for Testing and Failure Analysis - ISTFA, 3/11/2002, p.61-66Publication The role of grain boundary structure on electromigration-induced drift in pure Al and Al(0.5wt% Cu)
Journal article1998, Scripta Materialia, (39) 8, p.1039-1045