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Conference contributions
Effect of recrystallization and grain growth on the reliability of Cu-Cu wire bonds
Publication:
Effect of recrystallization and grain growth on the reliability of Cu-Cu wire bonds
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Date
2003
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Ratchev, Petar
;
Van De Peer, Myriam
;
Ho, Meng
;
Verlinden, B.
;
Bender, Hugo
;
De Wolf, Ingrid
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2042
since deposited on 2021-10-15
1
last month
Acq. date: 2025-12-09
Citations
Metrics
Views
2042
since deposited on 2021-10-15
1
last month
Acq. date: 2025-12-09
Citations