Publication:
Effect of recrystallization and grain growth on the reliability of Cu-Cu wire bonds
Date
| dc.contributor.author | Ratchev, Petar | |
| dc.contributor.author | Van De Peer, Myriam | |
| dc.contributor.author | Ho, Meng | |
| dc.contributor.author | Verlinden, B. | |
| dc.contributor.author | Bender, Hugo | |
| dc.contributor.author | De Wolf, Ingrid | |
| dc.contributor.imecauthor | Van De Peer, Myriam | |
| dc.contributor.imecauthor | Bender, Hugo | |
| dc.contributor.imecauthor | De Wolf, Ingrid | |
| dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
| dc.date.accessioned | 2021-10-15T06:20:14Z | |
| dc.date.available | 2021-10-15T06:20:14Z | |
| dc.date.issued | 2003 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/8060 | |
| dc.source.beginpage | 126 | |
| dc.source.conference | IMAPS-Nordic | |
| dc.source.conferencedate | 21/09/2003 | |
| dc.source.conferencelocation | Espoo Finland | |
| dc.source.endpage | 132 | |
| dc.title | Effect of recrystallization and grain growth on the reliability of Cu-Cu wire bonds | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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