imec Institutional Repository Browsing {{ collection }} by Author "Vos, I."

Publication

Copper CMP using a Lam teres linear planarization technology

Vos, I.

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Meuris, Marc

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Sijmus, Bram

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Stella, Mario

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Delaney, N.

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Gobbin, Korneel

Oral presentation

2001, 6th International Chemical-Mechanical Polish (C.M.P.) Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC) and

Publication

High Q inductor add-on module in thick Cu/SiLK/sup TM/ single damascene

Jenei, Snezana

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Proceedings paper

2001, Proceedings of the IEEE International Interconnect Technology Conference, 4/06/2001, p.107-109

Publication

Integration feasibility of porous SiLK semiconductor dielectric

Waeterloos, Joost

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Struyf, Herbert

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Van Aelst, Joke

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Castillo, D. W.

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Lucero, S.

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Caluwaerts, Rudy

Proceedings paper

2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference, 4/06/2001, p.253-254

Publication

Integration of a low permittivity spin-on embedded hardmask for Cu/SiLK resin dual damascene

Waeterloos, Joost

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Shaffer, E. O.

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Stokich, T.

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Hetzner, J.

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Price, D.

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Booms, L.

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Donaton, R. A.

Proceedings paper

2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference, 1/06/2001, p.60-62

Publication

Integration of Cu and low-K dielectrics: effect of hard mask and dry etch on electrical performance of damascene structures

Donaton, R. A.

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Coenegrachts, Bart

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Maenhoudt, Mireille

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Pollentier, Ivan

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Struyf, Herbert

Journal article

2001, Microelectronic Engineering, (55) 1_4, p.277-283

Browsing by Author "Vos, I."