Browsing by Author "Wagenleitner, Thomas"
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Publication 3D-SoC integration utilizing high accuracy wafer level bonding
Proceedings paper2016, IEEE 18th Electronics Packaging Technology Conference - EPTC, 30/11/2016, p.111-114Publication Advances in SiCN-SiCN bonding with high accuracy wafer-to-wafer (W2W) stacking technology
Proceedings paper2018, IEEE International Interconnect Technology Conference - IITC, 4/06/2018, p.985-992