Browsing by Author "Wojciechowski, Dominique"
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Publication Characterization of dynamic SOA of power MOSFETs limited by electrothermal breakdown
Proceedings paper2005-09, Proceedings of the 35th European Solid-State Device Research Conference - ESSDERC, 12/09/2005, p.465-468Publication Charge trapping effects and interface state generation in a 40V lateral resurf pDMOS transistor
Proceedings paper2005-09, Proceedings of the 35th European Solid-State Device Research Conference - ESSDERC, 12/09/2005, p.407-410Publication Design and characterization of a post-processed copper heat sink for smart power drivers
Proceedings paper2005-04, IEEE International Conference on Microelectronic Test Structures, 4/04/2005, p.27-31Publication Design of an x-Si Aactive matrix for high resolution reflective displays
Proceedings paper1995, Proceedings of the 15th International Display Research Conference. Asia Display 1995; October 1995; Hamamatsu, Japan., p.477-479Publication Electro-conductive adhesives for high density package and flip-chip interconnections
Journal article2000, Microelectronics Reliability, (40) 7, p.1215-1226Publication Flip-chip redistribution using stencilprinted bumps
Oral presentation1999, Area Array Packaging Technologies WorkshopPublication Lead-free solder BGAs and polymer stud grid arrays
Oral presentation2000, Electronics Goes Green 2000+; 11-13 September 2000; Berlin, Germany.Publication New adhesives for high density flip-chip interconnections
Proceedings paper1998, Proceedings IMAPS International Symposium on Microelectronics, 1/11/1998, p.224-229Publication Technology-Cad applied to the development of DMOS devices
Proceedings paper1995, Proceedings of the International Semiconductor Device Research Conference; December 1995; Charlottesville, VA, USA., p.785-788