Browsing by Author "Yu, C.H."
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Publication 3D stacking using Cu-Cu direct bonding for 40μm pitch and beyond
; ; ; ; Publication Cu-Cu hybrid bonding as option for 3D IC stacking
Proceedings paper2012, IEEE International Interconnect Technology Conference - IITC, 4/06/2012Publication Self aligned CuGeN process for 32/22nm nodes and beyond
Proceedings paper2008, 11th IEEE International Interconnect Technology Conference - IITC, 1/06/2008, p.199-201Publication The role of additives and deposition parameters in Cu plating of high aspect ratio vias
Meeting abstract2009-10, 216th ECS Meeting, 4/10/2009, p.2179