Publication:

The role of additives and deposition parameters in Cu plating of high aspect ratio vias

Date

2009
Meeting abstract
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18575.pdf 289.78 KB

Author(s)

Ko, Ted
;
Radisic, Alex  
;
Armini, Silvia  
;
Vereecken, Philippe  
;
Drijbooms, Chris  
;
Bender, Hugo  
;
Sun, S.P.
;
Wann, C.
;
Yu, C.H.
;
Leunissen, Peter
;
Ruythooren, Wouter  
;
Vanhaelemeersch, Serge  

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Abstract

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1853 since deposited on 2021-10-17
Acq. date: 2026-08-05

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