Publication:

The role of additives and deposition parameters in Cu plating of high aspect ratio vias

Date

2009-10
Meeting abstract
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dc.contributor.authorKo, Ted
dc.contributor.authorRadisic, Alex
dc.contributor.authorArmini, Silvia
dc.contributor.authorVereecken, Philippe
dc.contributor.authorDrijbooms, Chris
dc.contributor.authorBender, Hugo
dc.contributor.authorSun, S.P.
dc.contributor.authorWann, C.
dc.contributor.authorYu, C.H.
dc.contributor.authorLeunissen, Peter
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.imecauthorDrijbooms, Chris
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.date.accessioned2021-10-17T23:32:06Z
dc.date.available2021-10-17T23:32:06Z
dc.date.embargo9999-12-31
dc.date.issued2009-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15611
dc.source.beginpage2179
dc.source.conference216th ECS Meeting
dc.source.conferencedate4/10/2009
dc.source.conferencelocationVienna Austria
dc.title

The role of additives and deposition parameters in Cu plating of high aspect ratio vias

dc.typeMeeting abstract
dspace.entity.typePublication
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