Browsing by Author "Zanon, Franco"
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Publication Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components
Journal article2017, Microelectronics Reliability, 74, p.131-135Publication Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis
Proceedings paper2015, 16th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE, 20/04/2015, p.1-4Publication Improved and accurate physics-of-failure (PoF) nethodology for qualification and lifetime assessment of electronic systems
Journal article2017, Microelectronics Reliability, 76-77, p.42-46Publication Methodology for solder-joint lifetime prediction of LED-based PCB assemblies
Journal article2018, IEEE Transactions on Device and Materials Reliability, (18) 3, p.377-382Publication Physics of failure based quantification of life time for electronics board assemblies
Proceedings paper2017-06, IPC Reliability Forum, 27/06/2017