Browsing by Author "Zhang, S."
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Publication A hybrid thin-film laser driver module for RF frequency with a full-custom C07 analog driver amplifier
Proceedings paper1999, Proceedings of the IMAPS; October 1999; Chicago, USA., p.195-200Publication A new approach of flip chip on board technology using SMT compatible processes
Proceedings paper1999, Proceedings of the 12th European Microelectronics and Packaging Conference, 7/06/1999, p.111-117Publication A new approach to flip chip on board technology using SMT compatible processes
Journal article1999, Microelectronics International, (16) 3, p.39-42Publication A two-layer high density printed circuit board and its reliability
Journal article1999, Microelectronics and Reliability, (39) 9, p.1337-1341Publication Advanced PCB technologies: Photovia buildup, electroless nickel plating and flip chip on board
Zhang, S.PHD thesis1999-11Publication An MCM-D laser driver hybrid with RF amplifier chip, combining advanced FC assembly and novel single chip bumping technology
Proceedings paper2000, International Conference and Exhibition on High Density Interconnect and Systems Packaging; Aprl 2000; Denver, Co, USA., p.557-562Publication Cluster formation during annealing of ultra-low-energy boron-implanted silicon
Publication Electroless nickel plating bath composition and replenishment for microvia plating process
Proceedings paper2000, IMAPS-EUROPE PRAGUE 2000. European Microelectronics Packaging and Interconnection Symposium Proceedings, 18/06/2000, p.447-452Publication Photovia technology: some important aspects for reliability
Proceedings paper1999, Proceedings of the IMAPS; October 1999; Chicago, USA., p.240-245Publication Stabilizer concentration and local environment: their effects on electroless nickel plating of PCB micropads
Journal article1999, J. Electrochem. Soc., (146) 8, p.2870-2875Publication The fabrication and reliability of a photovia test vehicle for MCM-L applciations
Proceedings paper1998, Proceedings IMAPS International Symposium on Microelectronics, 1/11/1998, p.53-58Publication The realisation of photo-via technology using multiposit as a photo imageable dielectric
Proceedings paper1998, Proceedings of the 3rd European Conference on Electronic Packaging Technology and 9th International Conference on Interconnectio, 15/06/1998, p.62-65