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Dissertations
Advanced PCB technologies: Photovia buildup, electroless nickel plating and flip chip on board
Publication:
Advanced PCB technologies: Photovia buildup, electroless nickel plating and flip chip on board
Date
1999-11
Dissertation
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Zhang, S.
Journal
Abstract
Description
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1915
since deposited on 2021-10-14
421
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations
Metrics
Views
1915
since deposited on 2021-10-14
421
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations