Publication:
Advanced PCB technologies: Photovia buildup, electroless nickel plating and flip chip on board
Date
| dc.contributor.author | Zhang, S. | |
| dc.date.accessioned | 2021-10-14T11:59:43Z | |
| dc.date.available | 2021-10-14T11:59:43Z | |
| dc.date.issued | 1999-11 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/4045 | |
| dc.title | Advanced PCB technologies: Photovia buildup, electroless nickel plating and flip chip on board | |
| dc.type | PHD thesis | |
| dspace.entity.type | Publication | |
| Files | ||
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