Browsing by Author "Zhang, S. L."
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Publication Electrical and mechanical characterization of chemical vapor deposition of tungsten on sputter-deposited TiN layers
Journal article1995, J. Appl. Phys., (78) 12, p.7313-22Publication Electroless deposition of Cu with solutions containing either Mg2+ or Pd2+ ions
Journal article1999, Physica Scripta, T79, p.232-235Publication Impact of rapid thermal annealing of Ti/TiN bilayers on subsequent chemical vapor deposition of tungsten
Proceedings paper1996, Advanced Metallization for Future ULSI, 8/04/1996, p.365-370Publication Influence of hydrogen on chemical vapor deposition of tungsten on sputter-deposited TiN layers
Journal article1995, Appl. Phys. Lett., 67, p.2998-3000Publication Stress Reduction in Tungsten CVD Films by RTA Post-Treatment of Ti/TiN Bilayers in Ammonia
Oral presentation1995, Conference on Advanced Metallization and Interconnect Systems for ULSI Applications; October 3-5, 1995; Portland, Oregon, USA.