Browsing by Author "Zheng, T."
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Publication Buried metal line compatible with 3D sequential integration for top tier planar devices dynamic Vth tuning and RF shielding applications
Proceedings paper2019, 2019 Symposia on VLSI Technology and Circuits, 9/06/2019, p.T56-T57Publication First demonstration of 3D stacked Finfets at a 45nm fin pitch and 110nm gate pitch technology on 300mm wafers
Proceedings paper2018, IEEE International Electron Devices Meeting - IEDM, 1/12/2018, p.149-152Publication Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling
Proceedings paper2018, International Conference on IC Design and Technology - ICICDT, 4/06/2018, p.145-148