Browsing by Author "Zhu, C."
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Publication Backside Power Delivery With Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-Filled Slit Nano Through Silicon Vias
Journal article2024, IEEE TRANSACTIONS ON ELECTRON DEVICES, (71) 12, p.7963-7969Publication Buried Power Rail Metal exploration towards the 1 nm Node
Proceedings paper2021, IEEE International Electron Devices Meeting (IEDM), DEC 11-16, 2021Publication Integration of Through-Dielectric-Via on Buried Power Rail and Slit Nano Through-Silicon-Via for Enhanced Backside Connectivity
Proceedings paper2025, 2025 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, IITC, 2025-06-02Publication Selective ALD Mo Deposition in 10nm Contacts
Proceedings paper2023, IEEE International Interconnect Technology Conference (IITC) / IEEE Materials for Advanced Metallization Conference (MAM), MAY 22-25, 2023