Browsing by Author "de Vries, Hans"
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Publication Finite element analysis of ultra thin BGA package: first and second level reliability
Proceedings paper2004-05, EuroSimE: 5th Int. Conf. on Thermal & Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems, 9/05/2004, p.225-232Publication Reliability of a stretchable interconnect utilizing terminated, in-plane meandered copper conductor
Journal article2013, Microelectronics Reliability, 53, p.956-963