Browsing by Author "van de Wiel, H.J."
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Publication Mechanical and electrical propeties of ultra-thin chips and flexible electronics assemblies during bending
Publication Residual stress in silicon caused by Cu-Sn wafer-level packaging
Meeting abstract2013, International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK, 16/07/2013, p.73317