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Mechanical and electrical propeties of ultra-thin chips and flexible electronics assemblies during bending
Publication:
Mechanical and electrical propeties of ultra-thin chips and flexible electronics assemblies during bending
Date
2014
Journal article
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31327.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
van den Ende, Daan
;
van de Wiel, H.J.
;
Kusters, Roel
;
Sridhar, Ashok
;
Schram, Jeroen
;
Cauwe, Maarten
;
van den Brand, Jeroen
Journal
Microelectronics Reliability
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1925
since deposited on 2021-10-22
Acq. date: 2025-10-27
Citations
Metrics
Views
1925
since deposited on 2021-10-22
Acq. date: 2025-10-27
Citations