Mechanical and electrical propeties of ultra-thin chips and flexible electronics assemblies during bending

dc.contributor.author	van den Ende, Daan
dc.contributor.author	van de Wiel, H.J.
dc.contributor.author	Kusters, Roel
dc.contributor.author	Sridhar, Ashok
dc.contributor.author	Schram, Jeroen
dc.contributor.author	Cauwe, Maarten
dc.contributor.author	van den Brand, Jeroen
dc.contributor.imecauthor	Cauwe, Maarten
dc.contributor.orcidimec	Cauwe, Maarten::0000-0002-6413-998X
dc.date.accessioned	2021-10-22T07:02:02Z
dc.date.available	2021-10-22T07:02:02Z
dc.date.embargo	9999-12-31
dc.date.issued	2014
dc.identifier.issn	0026-2714
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/24671
dc.identifier.url	http://www.sciencedirect.com/science/article/pii/S0026271414003278
dc.source.beginpage	2860
dc.source.endpage	2870
dc.source.issue	12
dc.source.journal	Microelectronics Reliability
dc.source.volume	54
dc.title	Mechanical and electrical propeties of ultra-thin chips and flexible electronics assemblies during bending
dc.type	Journal article
dspace.entity.type	Publication
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