Browsing by author "Ostmann, A."
Now showing items 1-7 of 7
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Cost modelling for embedded component technology
De Baets, Johan; Willems, Geert; Ostmann, A.; Kriechbaum, A.; Kostner, H. (2007-06) -
High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SL/D)
Beyne, Eric; Van Hoof, Rita; Webers, Tomas; Brebels, Steven; Rossi, S.; Lechleiter, F.; Di Ianni, M.; Ostmann, A. (2001) -
High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SUD)
Beyne, Eric; Van Hoof, Rita; Webers, Tomas; Rossi, S.; Lechleiter, F.; Di Ianni, M.; Ostmann, A. (2000) -
HIPERPRINT= a board technology for high-frequency applications
De Baets, Johan; Vereeken, Maria; Van Calster, Andre; Corlatan, D.; Raedschelders, E.; Patra, G.; Morrell, M.; Haley, C.; Schols, G.; Ostmann, A.; Mathelin, D. (2000) -
Lead-free flip chip: a comparison between lead-free solder and adhesives
Vandecasteele, Bjorn; Vanfleteren, Jan; Manessis, D.; Ostmann, A.; Hagedorn, H.W.; Wiese, J (2005-06) -
Stretchable conductor technology for elastic electronic systems
De Baets, Johan; Axisa, Fabrice; Brosteaux, Dominique; Gonzalez, Mario; Loeher, T.; Manessis, D.; Heinrich, R.; Schmied, B.; Ostmann, A.; Vanfleteren, Jan (2007-03) -
Technology for embedding active dies
Ostmann, A.; De Baets, Johan; Kriechbaum, A.; Kostner, H.; Neumann, A. (2005-06)