Browsing by author "Cupak, Miroslav"

21 nm Pitch dual-damascene BEOL process integration with full barrierless Ru metallization

Vega Gonzalez, Victor; Wilson, Chris; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Versluijs, Janko; Blanco, Victor; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Lesniewska, Alicja; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Pardons, Katrien; Barla, Kathy; Tokei, Zsolt (2019)

A practical approach to thermal modeling and validation of 3D-ICs

Cupak, Miroslav; Oprins, Herman; Van der Plas, Geert; Marchal, Pol; Vandevelde, Bart; Srinivasan, Adi; Cheng, Edmund (2010)

An automatic scratch pad memory management tool and MPEG-4 encoder case study

Baert, Rogier; De Greef, Eddy; Brockmeyer, Erik; Vanmeerbeeck, Geert; Avasare, Prabhat; Mignolet, Jean-Yves; Cupak, Miroslav (2008)

Design issues and cosiderations for low-cost 3D TSV IC technology

Van der Plas, Geert; Limaye, Paresh; Mercha, Abdelkarim; Oprins, Herman; Torregiani, Cristina; Thijs, Steven; Linten, Dimitri; Stucchi, Michele; Guruprasad, Katti; Velenis, Dimitrios; Shinichi, Domae; Cherman, Vladimir; Vandevelde, Bart; Simons, Veerle; De Wolf, Ingrid; Labie, Riet; Perry, Dan; Bronckers, Stephane; Minas, Nikolaos; Cupak, Miroslav; Ruythooren, Wouter; Van Olmen, Jan; Phommahaxay, Alain; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Rakowski, Michal; De Wachter, Bart; Dehan, Morin; Nelis, Marc; Agarwal, Rahul; Dehaene, Wim; Travaly, Youssef; Marchal, Pol; Beyne, Eric (2010)

Design, verification and simulation of 3D circuit

Katti, Guruprasad; De Wachter, Bart; Nelis, Marc; Dehan, Morin; Cupak, Miroslav; Croes, Kris; Beeckman, Gerd; Marchal, Pol; Stucchi, Michele (2009)

Efficient functional validation of system-level loop transformations for multi-media applications

Cupak, Miroslav; Catthoor, Francky (1997)

Efficient system-level functional verification methodology for multimedia applications

Cupak, Miroslav; Catthoor, Francky; De Man, Hugo (2003)

Experimental characterization and model validation of thermal hot spot dissipation in 3D stacked ICs

Oprins, Herman; Cherman, Vladimir; Srinivasan, Adi; Cupak, Miroslav; Van der Plas, Geert; Marchal, Pol; Vandevelde, Bart; Cheng, Edmund (2010-10)

Fine grain thermal modeling of 3D stacked structures

Oprins, Herman; Cupak, Miroslav; Van der Plas, Geert; Vandevelde, Bart; Marchal, Pol; Srinivasan, Adi; Cheng, Edmund (2009-10)

Fine grain thermal modelling and expermintal validation of 3D-ICs

Oprins, Herman; Srinivasan, Adi; Cupak, Miroslav; Cherman, Vladimir; Torregiani, Cristina; Stucchi, Michele; Van der Plas, Geert; Marchal, Pol; Vandevelde, Bart; Cheng, Ed (2011-04)

Functional validation of system-level loop transfomations for power efficient caching

Cupak, Miroslav; Kulkarni, Chidamber; Catthoor, Francky; De Man, Hugo (1998)

Interconnected magnetic tunnel junctions for spin-logic applications

Manfrini, Mauricio; Vaysset, Adrien; Wan, Danny; Raymenants, Eline; Swerts, Johan; Rao, Siddharth; Zografos, Odysseas; Souriau, Laurent; Babaei Gavan, Khashayar; Rassoul, Nouredine; Radisic, Dunja; Cupak, Miroslav; Dehan, Morin; Sayan, Safak; Nikonov, Dmitry E.; Manipatruni, Sasikanth; Young, Ian A.; Mocuta, Dan; Radu, Iuliana (2018)

Interconnected MTJs driven by STT for spin-logic applications

Manfrini, Mauricio; Vaysset, Adrien; Wan, Danny; Raymenants, Eline; Swerts, Johan; Rao, Siddharth; Souriau, Laurent; Babaei Gavan, Khashayar; Rassoul, Nouredine; Radisic, Dunja; Cupak, Miroslav; Dehan, M; Sayan, S; Nikonov, D.E.; Manipatruni, S; Young, I. A.; Mocuta, Dan; Radu, Iuliana (2017)

MPEG-4 video decoder

Cupak, Miroslav; Rynders, Luc (2005)

OCAPI-XL based approach

Cupak, Miroslav; Rynders, Luc (2005)

Process Integration of High Aspect Ratio Vias with a Comparison between Co and Ru Metallizations

Vega Gonzalez, Victor; Montero Alvarez, Daniel; Versluijs, Janko; Varela Pedreira, Olalla; Jourdan, Nicolas; Puliyalil, Harinarayanan; Chehab, Bilal; Peissker, Tobias; Haider, Ali; Batuk, Dmitry; Martinez Alanis, Gerardo Tadeo; Geypen, Jef; Le, Quoc Toan; Bazzazian, Nina; Heylen, Nancy; van der Veen, Marleen; El-Mekki, Zaid; Webers, Tomas; Vats, H.; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Gillijns, Werner; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Ciofi, Ivan; De Wachter, Bart; Swerts, Johan; Grieten, Eva; Ercken, Monique; Kim, Ryan Ryoung han; Croes, Kristof; Leray, Philippe; Jaysankar, Manoj; Nagesh, Nishanth; Ramakers, Leon; Murdoch, Gayle; Park, Seongho; Tokei, Zsolt; Dentoni Litta, Eugenio; Horiguchi, Naoto (2021)

Realization of wireless multimedia communication systems on reconfigurable platforms

Masselos, Kostas; Pelkonen, Antti; Cupak, Miroslav; Blionas, S. (2003)

Standard-cell design architecture options below 5nm node: the ultimate scaling of FinFET and nanosheet

Sherazi, Yasser; Cupak, Miroslav; Weckx, Pieter; Zografos, Odysseas; Jang, Doyoung; Debacker, Peter; Verkest, Diederik; Mocuta, Anda; Kim, Ryan Ryoung han; Spessot, Alessio; Ryckaert, Julien (2019)

Supervia Process Integration and Reliability Compared to Stacked Vias Using Barrierless Ruthenium

Vega Gonzalez, Victor; Puliyalil, Harinarayanan; Versluijs, Janko; Lesniewska, Alicja; Varela Pedreira, Olalla; Baert, Rogier; Paolillo, Sara; Decoster, Stefan; Schleicher, Filip; Montero Alvarez, Daniel; Bekaert, Joost; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Teugels, Lieve; Heylen, Nancy; Jourdan, Nicolas; El-Mekki, Zaid; van der Veen, Marleen; Ciofi, Ivan; Briggs, Basoene; Heijlen, Jeroen; Dupas, Luc; De Wachter, Bart; Vancoille, Eric; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Demonie, Ingrid; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Jaysankar, Manoj; Wilson, Chris; Murdoch, Gayle; Tokei, Zsolt (2020)

System-Level Functional Validation of Multimedia Applications

Cupak, Miroslav (1999-03)