Browsing by author "Vandepitte, D."
Now showing items 1-9 of 9
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Analytical thermo-mechanical model for non-underfilled area array flip chip assemblies
Vandevelde, Bart; Beyne, Eric; Vandepitte, D.; Baelmans, M. (2004-09) -
Influence of printed circuit board properties on solder joint fatigue life of assembled IC packages
Vandevelde, Bart; Gonzalez, Mario; Beyne, Eric; Vandepitte, D.; Baelmans, M. (2004) -
Modified micro-macro thermo-mechanical modelling of ceramic ball grid array packages
Vandevelde, Bart; Degryse, Dominiek; Beyne, Eric; Roose, E.; Corlatan, D.; Swaelen, G.; Willems, G.; Christiaens, F.; Vandepitte, D.; Baelmans, M. (2003) -
Parameter study for the reliability of underfilled flip chip and CSP assemblies
Vandevelde, Bart; Degryse, Dominiek; Beyne, Eric; Vandepitte, D.; Baelmans, M. (2002) -
Parameterised modelling of thermo-mechanical reliability for CSP assemblies
Vandevelde, Bart; Beyne, Eric; Zhang, K.G.Q.; Caers, J.; Vandepitte, D.; Baelmans, M. (2003) -
Semi-analytical model for calculation of induced strains in solder joints of underfilled flip chip assemblies
Vandevelde, Bart; Beyne, Eric; Vandepitte, D.; Baelmans, M. (2002) -
Semi-analytical model for calculation of induced strains in solder joints of underfilled flip chip assemblies
Vandevelde, Bart; Beyne, Eric; Vandepitte, D.; Baelmans, M. (2002) -
Solder parameter sensitivity for CSP life-time prediction using simulation-based optimisation method
Vandevelde, Bart; Beyne, Eric; Zhang, K.G.Q.; Caers, J.F.J.M.; Vandepitte, D.; Baelmans, Martine (2002) -
Thermomechanical models for leadless solder interconnections in flip chip assemblies
Vandevelde, Bart; Christiaens, Filip; Beyne, Eric; Roggen, Jean; Peeters, J.; Allaert, K.; Vandepitte, D.; Bergmans, J. (1998)