Browsing by author "Druais, Gael"
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High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed
Druais, Gael; Dilliway, Gabriela; Fischer, P.; Guidotti, E.; Bureau, C.; Palmans, Roger; Radisic, Alex (2008) -
High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed
Druais, Gael; Dilliway, G.; Fischer, P.; Guidotti, E.; Luhn, Ole; Radisic, Alex; Zahraoui, S. (2008) -
Integration of 50 nm half pitch single damascene copper trenches in BDII by means of double patterning 193 nm immersion lithography on metal hardmask
Van Olmen, Jan; Al-Bayati, A; Beyer, Gerald; Boelen, Pieter; Carbonell, Laure; Zhao, Chao; Ciofi, Ivan; Claes, Martine; Cockburn, Andrew; Druais, Gael; Hendrickx, Dirk; Heylen, Nancy; Kesters, Els; Lytle, S.; Noori, A.; Op de Beeck, Maaike; Struyf, Herbert; Tokei, Zsolt; Versluijs, Janko (2007)