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Integration of 50 nm half pitch single damascene copper trenches in BDII by means of double patterning 193 nm immersion lithography on metal hardmask
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Authors
Van Olmen, Jan
;
Al-Bayati, A
;
Beyer, Gerald
;
Boelen, Pieter
;
Carbonell, Laure
;
Zhao, Chao
;
Ciofi, Ivan
;
Claes, Martine
;
Cockburn, Andrew
;
Druais, Gael
;
Hendrickx, Dirk
;
Heylen, Nancy
;
Kesters, Els
;
Lytle, S.
;
Noori, A.
;
Op de Beeck, Maaike
;
Struyf, Herbert
;
Tokei, Zsolt
;
Versluijs, Janko
Conference
Advanced Metallization Conference - AMC
Title
Integration of 50 nm half pitch single damascene copper trenches in BDII by means of double patterning 193 nm immersion lithography on metal hardmask
Publication type
Oral presentation
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