Publication:
Integration of 50 nm half pitch single damascene copper trenches in BDII by means of double patterning 193 nm immersion lithography on metal hardmask
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2072 since deposited on 2021-10-16
3last month
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Acq. date: 2026-05-01
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Statistics
Views
2072 since deposited on 2021-10-16
3last month
1last week
Acq. date: 2026-05-01
Citations