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Integration of 50 nm half pitch single damascene copper trenches in BDII by means of double patterning 193 nm immersion lithography on metal hardmask
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2078 since deposited on 2021-10-16
4last month
Acq. date: 2026-08-28
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Statistics
Views
2078 since deposited on 2021-10-16
4last month
Acq. date: 2026-08-28
Citations