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Integration of 50 nm half pitch single damascene copper trenches in BDII by means of double patterning 193 nm immersion lithography on metal hardmask
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2068 since deposited on 2021-10-16
2last month
Acq. date: 2025-12-09
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Metrics
Views
2068 since deposited on 2021-10-16
2last month
Acq. date: 2025-12-09
Citations