Integration of 50 nm half pitch single damascene copper trenches in BDII by means of double patterning 193 nm immersion lithography on metal hardmask

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Author(s)

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Carbonell, Laure

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Cockburn, Andrew

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Hendrickx, Dirk

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Op de Beeck, Maaike

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Struyf, Herbert

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Versluijs, Janko

Metrics

2063 since deposited on 2021-10-16

Acq. date: 2025-10-23