Publication:
Integration of 50 nm half pitch single damascene copper trenches in BDII by means of double patterning 193 nm immersion lithography on metal hardmask
Date
Loading...
Journal
Abstract
Description
Statistics
Views
2068 since deposited on 2021-10-16
Acq. date: 2026-01-26
Citations
Statistics
Views
2068 since deposited on 2021-10-16
Acq. date: 2026-01-26
Citations