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Integration of 50 nm half pitch single damascene copper trenches in BDII by means of double patterning 193 nm immersion lithography on metal hardmask

Date

2007
Presentation
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dc.contributor.authorVan Olmen, Jan
dc.contributor.authorAl-Bayati, A
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBoelen, Pieter
dc.contributor.authorCarbonell, Laure
dc.contributor.authorZhao, Chao
dc.contributor.authorCiofi, Ivan
dc.contributor.authorClaes, Martine
dc.contributor.authorCockburn, Andrew
dc.contributor.authorDruais, Gael
dc.contributor.authorHendrickx, Dirk
dc.contributor.authorHeylen, Nancy
dc.contributor.authorKesters, Els
dc.contributor.authorLytle, S.
dc.contributor.authorNoori, A.
dc.contributor.authorOp de Beeck, Maaike
dc.contributor.authorStruyf, Herbert
dc.contributor.authorTokei, Zsolt
dc.contributor.authorVersluijs, Janko
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorCockburn, Andrew
dc.contributor.imecauthorHendrickx, Dirk
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorOp de Beeck, Maaike
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorVersluijs, Janko
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimecOp de Beeck, Maaike::0000-0002-2700-6432
dc.date.accessioned2021-10-16T20:48:28Z
dc.date.available2021-10-16T20:48:28Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13079
dc.source.conferenceAdvanced Metallization Conference - AMC
dc.source.conferencedate9/10/2007
dc.source.conferencelocationAlbany, NY USA
dc.title

Integration of 50 nm half pitch single damascene copper trenches in BDII by means of double patterning 193 nm immersion lithography on metal hardmask

dc.typeOral presentation
dspace.entity.typePublication
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