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High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed
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Authors
Druais, Gael
;
Dilliway, Gabriela
;
Fischer, P.
;
Guidotti, E.
;
Bureau, C.
;
Palmans, Roger
;
Radisic, Alex
Conference
17th Workshop Materials for Advanced Metallization
Title
High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed
Publication type
Meeting abstract
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