Publication:
High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed
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1986 since deposited on 2021-10-17
2last month
1last week
Acq. date: 2025-12-10
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Views
1986 since deposited on 2021-10-17
2last month
1last week
Acq. date: 2025-12-10
Citations