High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed

Author(s)

Druais, Gael

;

Dilliway, G.

;

Fischer, P.

;

Guidotti, E.

;

Luhn, Ole

;

;

Zahraoui, S.

Microelectronic Engineering

1984 since deposited on 2021-10-17

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Acq. date: 2025-10-24