Browsing by author "Hiebert, S."
Now showing items 1-3 of 3
-
Defect learning methodology applied to microbump process at 20μm pitch and below
Liebens, Maarten; Slabbekoorn, John; Miller, Andy; Beyne, Eric; Stoerring, M.; Hiebert, S.; Cross, A. (2018) -
In-line metrology for characterization and control of extreme wafer thinning of bonded wafers
Liebens, Maarten; Jourdain, Anne; De Vos, Joeri; Vandeweyer, Tom; Miller, Andy; Beyne, Eric; Li, Shifang; Bast, G.; Stoerring, Moritz; Hiebert, S.; Cross, Andrew (2017) -
What's in space – Exploration and improvement of line/space defect inspection of fine-pitch redistribution layer for fan-out wafer level packaging
Liebens, Maarten; Slabbekoorn, John; Miller, Andy; Beyne, Eric; Yeoh, Richard; Krah, T.; Vangal, A.; Hiebert, S.; Cross, A. (2019)